The initiative is part of the semiconductor maker’s Project Athena initiative. According to reports, the new cooling solutions will have new thermal designs, featuring a combination of vapour chamber and graphite sheets. There’s still not a lot of detail, but the semiconductor maker has said that its new cooling solutions could enable future notebooks to run 30% cooler than currently existing ones. Having new cooling solutions for notebooks would definitely be a boon, not just for consumers, but also notebook manufacturing partners. At current, thermal dissipation components are stuck between the keyboard and the integral components of a notebook. These designs still use a combination of high-performance fans and shaped heat pipes, stuck on to both CPU and discrete GPU. Intel hopes that with its new cooling solutions will enable its partners to churn out more fanless notebook designs, that in turn would also allow them to shave off more weight and thickness from a notebook’s design. Moreover, it is also possible that the new cooling solutions could be applied to gaming notebooks as well. In any case, we’ll just have to wait until CES 2020 to find out just what Intel and its partners have in store. (Source: DigiTime via Techspot)
